FR4 is an abbreviation for Flame Retardant 4 (flame-retardant rating 4) and complies with the UL94V-0 standard. It refers to a composite material composed of epoxy resin and glass fiber cloth.
An FR4 PCB is a printed circuit board (PCB) that uses FR4 as its base material. It accounts for over 70% of the global PCB market and serves as the "universal substrate" in the electronics industry.
Physical and Chemical Properties
Electrical Properties
General Electronic Devices
Special Requirement Scenarios
| Characteristic | FR4 | High-Frequency Materials (e.g., Rogers) | Metal-Core Boards (e.g., Aluminum Boards) |
|---|---|---|---|
| Cost | Low (20/m²) | High (500/m²) | Medium (100/m²) |
| Applicable Frequency | Up to 10 GHz | Unlimited (with a focus on heat dissipation) | - |
| Thermal Conductivity | 0.3 W/m·K | 0.5–1.5 W/m·K | 1–5 W/m·K |
| Typical Applications | General circuits | 5G antennas, radar | LED lighting, power modules |
Moisture Absorption Management
FR4 is prone to moisture absorption (with an absorption rate of approximately 0.1%–0.3%). It needs to be baked before soldering (e.g., at 120°C for 2 hours) to prevent "board popping."
Coefficient of Thermal Expansion (CTE) Matching
FR4 has a relatively high Z-axis CTE (50–70 ppm/°C). Direct soldering with components having a high CTE (such as ball grid arrays (BGAs)) should be avoided.
High-Frequency Alternatives
For high-frequency performance requirements, hybrid PCBs (combining FR4 with localized layers of high-frequency materials) can be used.
FR4 PCBs remain the preferred substrate material in electronic design due to their low cost, high reliability, and ease of processing. However, in high-frequency and high-heat-dissipation scenarios, targeted material substitutions are necessary. During the design process, performance and cost must be balanced based on specific requirements.
FR4PCB.TECH, Specialized Production: FP4, High TG, halogen-free, aluminum/copper/ceramic-based, and Rogers material printed circuit boards (PCBs).
Offerings: Double-sided boards, multilayer boards, HDI (High-Density Interconnect) boards, rigid-flex boards, high-frequency boards, etc., to cater to diverse requirements.
Surface Finish Processes: OSP (Organic Solderability Preservative), HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel/Immersion Gold), immersion silver, immersion tin, electroplated nickel-gold, and electroless palladium, etc.
Product Application Areas: Industrial control, telecommunications equipment, consumer electronics, automotive electronics, medical devices, aerospace, computers and data centers, energy and power, IoT (Internet of Things) and smart home, military and defense, marine electronics, AI (Artificial Intelligence) terminals.
Contact us immediately at info@fr4pcb.tech to obtain preferential quotations.