In the rapidly evolving field of network communication, the demand for high-performance, compact, and reliable printed circuit boards (PCBs) is ever-increasing. Our Any-layer HDI Network Communication PCBs are specifically designed to meet these stringent requirements.
These PCBs are constructed with 10 layers and a 5-step layer stack-up configuration. This advanced stack-up enables efficient signal routing and power distribution within a thin profile, with a board thickness of just 0.7mm and a thickness ratio of 1.03:1, ensuring excellent mechanical stability and electrical performance.
One of the standout features of our PCBs is the any-layer interconnection capability. This is made possible through the use of blind vias with a minimum aperture of 0.1mm, in addition to through-holes with a minimum aperture of 0.6mm. The blind vias allow for direct connections between any two layers, eliminating the need for complex via transitions and enabling more compact and high-density circuit designs. This is particularly crucial in network communication devices where space is at a premium and signal integrity is of utmost importance.
Our PCBs also boast ultra-fine trace widths and spacings of 50/50μm, allowing for a higher component density and more complex circuit layouts. This is essential for supporting the advanced functionalities required in modern network communication systems.
To ensure long-term reliability and excellent solderability, we employ a dual surface treatment of Immersion Gold (ENIG) and OSP (Organic Solderability Preservative). ENIG provides a durable, corrosion-resistant finish that enhances the electrical conductivity and solder joint strength, while OSP offers additional protection against oxidation during storage and handling.
For high-quality Any-layer HDI Network Communication PCBs, contact us at info@fr4pcb.tech.
