14 Layers HDI multilayer PCB manufacturing

In the realm of high - density interconnect (HDI) printed circuit boards, achieving optimal performance and miniaturization is of paramount importance. Our HDI multilayer PCBs stand out with their advanced design and manufacturing capabilities.

These PCBs are constructed with 14 layers, utilizing a sophisticated 7 - step layer stack - up configuration. This intricate stack - up allows for efficient signal routing and power distribution within a compact form factor, meeting the demands of modern electronic devices that require high functionality in limited space.

One of the key features of our HDI PCBs is the precise via technology. We offer through - holes with a diameter of 0.5mm, which provide reliable connections between different layers for standard signal and power transfer. Additionally, the blind vias with a diameter of 0.1mm enable more complex and dense circuit designs. These blind vias can be precisely placed to connect specific layers, facilitating any - layer interconnection. This means that signals can be routed directly between any two layers without being restricted by traditional via placement rules, significantly enhancing the design flexibility and electrical performance of the PCB.

The surface treatment of our HDI PCBs is an Immersion Gold (ENIG) finish. ENIG provides several advantages, including excellent solderability, which ensures reliable component attachment during the assembly process. It also offers good corrosion resistance, protecting the copper traces from environmental factors and extending the service life of the PCB.

For high - quality HDI multilayer PCBs that meet your specific requirements, please contact us at info@fr4pcb.tech.