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Home > Three-Phase Smart Meter PCB 4 Layer FR4
  • Three-Phase Smart Meter PCB 4 Layer FR4
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  • Three-Phase Smart Meter PCB 4 Layer FR4
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Three-Phase Smart Meter PCB 4 Layer FR4

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Three-Phase Smart Meter PCB, optimized for industrial energy monitoring. Features FR4 material (Tg≥150℃), 4-layer design, ENIG finish, and ±0.5% current accuracy, ensuring reliable power measurement.

Layers: 4
Base material: FR4  
Cu foil finish (outter layers): 35 um 
Cu foil finish (inner layers): 35 um
Board thickness: 1.6 mm
Plated mechanical holes - PTH: NO
Solder mask: green
Silkscreen: white
Surface finish: HASL PB-Free
Outline dimension: 185.5 x 190 mm
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  • Three-Phase Smart Meter PCB 4 Layer FR4
  • Three-Phase Smart Meter PCB 4 Layer FR4
1/1
  • Three-Phase Smart Meter PCB 4 Layer FR4
  • Description
The Three-Phase Smart Meter PCB is engineered for high-precision industrial energy management, leveraging advanced materials and design to meet stringent accuracy and reliability standards. Built with FR4 epoxy glass fiber substrate (Tg≥150℃), it withstands extreme temperatures (-40℃ to +130℃) and maintains dimensional stability (CTE ≤14ppm/℃ in X/Y axis). The 4-layer architecture (2 signal layers + 2 power planes) supports high-density routing (trace width/spacing 4mil/4mil) and reduces electromagnetic interference (EMI). Key features include a 1.6mm board thickness, 1oz (35μm) copper foil for enhanced current-carrying capacity (up to 15A per trace), and ENIG surface finish (Ni 3-6μm, Au 0.03-0.05μm) for corrosion resistance and solderability. The PCB achieves ±0.5% current sampling accuracy and ±1% voltage measurement precision, enabling real-time monitoring with 0.5S-class metering standards. It passes 1,000 thermal cycles (-40℃~+125℃) and complies with IEC 62053-22/23, ensuring 10+ years of field reliability.
High-Layer Count PCBs Technics Capacity
No. Item Description DataSheet
1  Layer Layer 1-98
2  Material Brand SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec
3  Surface treatment HASL lead-free,Immersion Gold, OSP, Immersion Tin, Immersion Silver,
Plating Gold, Plating Tin, ENEPIG
4  Selectivity surface treatment ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion
Tin+G/F
5  Solder mask color Green, Yellow, Black, Matte black, Blue, Red, White,Matte green
6  Silkscreen color White, Yellow, Black
7  Max board size with 2L mm 2000*1500mm
8  Max board size with 4L,6L mm 1200*1000mm(Exceeding 570mm shall be reviewed)
9  Max board size with more than 8L mm 1200*1000mm(Exceeding 570mm shall be reviewed)
10  Min board size mm 0.5*1.0mm(thickness≤0.5mm), 1.0*2.0mm(thickness≥0.5mm)
11  Min outline tolerance mm ±0.05mm(Laser Routing), ±0.1mm(Mechanical Routing)
12  PCB Board Thickness mm 0.13-8mm
13  Double side board thickness mm 0.13-3.6mm
14  4Layers board thickness mm 0.30-7mm
15  6Layers board thickness mm 0.6-8mm(6L), 0.8-8mm(8L), 1.0-8mm(10L), 1.0-8mm(12L)
16  The tolerance of board thickness mm ±0.1mm(thickness≤1.0mm), ± 10%mm(thickness>1.0mm)
17  Min Drilling hole size mm 0.075-0.1mm(Laser), 0. 15mm(Mechanical)
18  Single Max Drilling ww 6.5mm(Drill Bit)
19  Max Drilling ww 50mm
20  Min PTH tolerance mm ±0.05mm, ±0.075mm
21  Min NPTH tolerance mm ±0.05mm(Limitation+0, -0.05mm or +0.05, -0mm)
22  Min hole tolerance ww ±0.075mm
23  Max Drilling tolerance ww ±0.1mm
24  Slot hole mm 0.5-6mm
25  Min slot hole length mm 1.0mm
26  Slot hole aspect ratio mm 1:2
27  Min slot hole tolerance mm Slot width, ±0.15mm
28  Min slot hole tolerance mm Slot width directiont0.10, slot length direction±0.15
29  Countersink hole angle &size Big hole82, 90, 120degree, dia≤10mm
30  Countersink hole angle & size PTH&NPTH, Big hole angle 130degree, The dia of the large hole is not
greater than 6.3mm
31  Min pattern width/spacing mm 0.075mm/0.075mm
32  Pattern width tolerance mm ±20um
33  Min pad mm 0.15mm
34  FR-4 PP 106, 1080, 3313, 2116, 7628
35  Mult press blind buried hole production Press on the same sides5
36  Max bore diameter of pad hole plug hole mm 0.4 Multi press blind & buried hole board
37  Min thickness of inner mm 0.05(none blind buried hole), 0. 13(blind buried hole)
38  Min inner mil 3(18um base copper), 4(35um base copper), ≥3mil
39  Inner layer treatment Brown Oxygen
40  Min inner pattern spacing
(105um base copper, after compensation)		 mil 5 
41  Min inner layer pattern spacing
(140um base copper, after compensation)		 mil 7 
42  Min innner layer pattern spacing
(18um base copper, after compensation)		 mil 3 
43  Min inner layer pattern spacing
(35um base copper, after compensation)		 mil 3.5 
44  Min inner layer pattern spacing
(70um base copper, after compensation)		 mil 4 
45  Min inner layer pattern width
(105um base copper, before compensation)		 mil 5 
46  Min inner layer pattern width
(140um base copper, before compensation)		 mil 7 
47  Min inner layer pattern width
(18um base copper, before compensation)		 mil 3 
48  Min inner layer pattern width
(35um base copper, before compensation)		 mil 3 
49  Min inner layer pattern width
(70um base copper, before compensation)		 mil 4 
50  Min outer layer pattern spacing
(105um base copper, after compensation)		 mil 6 
51  Min outer layer pattern spacing
( 12, 18um base copper, after compensation)		 mil 3.0(18um), 2.5(12um)
52  Min outer layer pattern spacing
(140um base copper, after compensation)		 mil 7 
53  Min outer layer pattern spacing
(35um base copper, after compensation)		 mil 3.5 
54  Min outer layer pattern spacing
(70um base copper, after compensation)		 mil 5 
55  Min outer layer pattern width
(105um base copper, before compensation)		 mil 8 
56  Min outer layer pattern width
( 12, 18um base copper, before compensation)		 mil 3.5(18um), 3(12um)
57  Min outer layer pattern width
(140um base copper, before compensation)		 mil 9 
58  Min outer layer pattern width
(35um base copper, before compensation)		 mil 4.5 
59  Min outer layer pattern width
(70um base copper, before compensation)		 mil 6 
60  Min.spacing from pattern to pad, pad to pad
for outer layer(after compensation)		 mil 3(12, 18um), 3.5(35um), 5(70um), 6(105, 140um)
61  Min.outer pattern and spacing with blind/buried
holes plated many times(>=2times)		 mil 3.5/3.5 (before compensation)
62  Min distance from inner layer edge without
copper leakage		 mil 10 
63  Min inner layer isolation width mil 8 
64  Min inner layer isolation ring mil 8(≤6layer), 10(≥8layer)
65  Min single side width of inner pad
(none blind buried hole)		 mil 4.5(18, 35um, Can be partial 4), 6(70um), 8(105um)
66  Min single side width of inner pad
(laser hole)		 mil 3 
67  Impedance tolerance % ±5Ω(＜50Ω), ± 10%(≥50Ω);
≥50Ω±5%(need to evaluate when it requests),
68  Min BGA pad diameter mil 7mil
69  Min pad diameter mil 12(0.10mmMechanical or laser drilling)
70  Min hole copper thinckness
(none blind buried hole)		 um average 25, min single point≥20
71  Min hole copper thinckness
(blind buried hole)		 um averager 20, min single point≥18
72  PP thickness(min) um 0.075(only H oz base copper)
73  ENIG: gold thickness um 0.025-0.10
74  ENIG: nickle thickness um 3-5
75  Immersion silver.silver thickness um 0.1-0.3
76  Min HASL LeadFree/pure tin thickness um 0.4 
77  Gold Finger:gold thickness um 0.25-1.3(The required value is the thinnest point)
78  Gold Finger:nickle thickness um 3-5
79  Flash Gold:gold thickness um 0.025-0.10
80  Golden finger chamfer Angle tolerance ±5
81  Golden finger chamfering margin tolerance mil ±5
82  Min gold finger length inch 2 
83  Min distance between gold fingers mil 6 
84  Gold finger next to the TAB does not hurt
the min distance		 mm 7(Means automatic chamfering)
85  Long and short gold finger Can be combined with various surface treatments
86  Surface treatment for long and short goldfinger Immersion gold;Flash gold
87  Immersion tin:Tin thickness um 0.8-1.5
88  Electroplate hard gold thick um 0.15-1.3
89  Flash Gold: nickle thickness um 3-5
90  Max borad thickness of mechanical drilling
0.10mm		 mm 0.60 
91  Max borad thickness of mechanical drilling
0.15mm		 ww 1.20 
92  Max borad thickness of router bit 0.25mm mm 5 
93  Bow and twist capability limit % 0.1(need to evaluate when it requests ≤0.3)
94  Max Dry film sealing slot 5mm*3.0mm;More than one side of sealing hole15mil
95  Min unilateral width of dry film sealing hole mil 10 
96  Max diameter of dry film sealing hole mm 4.5 
97  Min width of solder mask opening mil 8 
98  Min solder mask thickness um 10 
99  Min S/M bridge width mil 3(green), 5(other color)(base copper≤10Z)(base coppe2-40Z, All in
accordance with the 6mil)
100  Min unilateralI width of solder mask mil 2.5(Allow local2mil)
101  Min solder mask opening (sing side) mil 2(Flash gold local 1.5, other allow local 1)
102  Max diameter of ink plug hole(both side) mm 0.65 
103  Thickness of solder mask ink through hole
cover		 um 5/8
104  V-CUT Angle specifications 20。, 30。, 45。, 60。
105  V-CUT(1.0 mm 0.36(20。), 0.4(30。), 0.5(45。), 0.6(60。)
106  V-CUT(1.6 mm 0.42(20。), 0.51(30。), 0.64(45。), 0.8(60。)
107  V-CUT(2.5≤H≤3.0mm) mm 0.47(20。), 0.59(30。), 0.77(45。), 0.97(60。)
108  V-CUT(H≤1.0mm) mm 0.3(20。), 0.33(30。), 0.37(45。), 0.42(60。)
109  V-CUT Symmetry tolerance mil ±4
110  V-CUT Angle tolerance 0  ±5
111  V-CUT Residue thickness mil ±4
112  Blue glue white mesh plug hole max
diameter		 mm 2 
113  Min single side of blue cover pattern or pad mil 2 
114  Max diameter of blue plastic aluminum plug
hole		 mm 4.5 
115  Min isolation between blue glue and pad mil 12 
116  Min single side carbon cap pattern mil 2 
117  Min isolation between carbon and pad mil 8 
118  Min isolation between carbon and carbon mil 12 
119  Min gridding spacing mil 5( 12, 18, 35um), 8(70um)
120  Min gridding width mil 5( 12, 18, 35um), 10(70um)
121  Min silk width and height
( 12, 18um base copper)		 width 4mil, height:23mil
122  Min silk width and height
(35um base copper)		 width 5mil, height:30mil
123  Min silk width and height
(70um base copper)		 width 6mil, height:45mil
124  Min isolation of silk and pad mil 6 
125  Min test on resistance Ω 10 
126  Min distance from test point to edge mm 0.5 
127  Max test current mA 200 
128  Max test voltage V 250 
129  WNH mil 3.9 
130  Min test pad mil 3.9 
131  Min etch logo width mil 8(12, 18um), 10(35um), 12(70um)
132  Outline tolerance(edge to edge) mil ±4(Complex outlin and inner grooves with this requirement shall be reviewed)
133  Min inner angular radius mm 0.4 
134             Depth control slot hole
( edge) or Blind slot precision(NPTH)		 mm ±0.10
135  Special tolerance requirements for board
        thickness (No interlayer structure		 mm ≤2.0±0.1, 2.0-3.0±0.15, ≥3.0±0.2
136                           i          t)
Max ratio of plate thickness to hole		 20:1(not inclue≤0.2mm diameter, more than 12:1 shall be reviewed))
137  Min hole diameter mm 0.45 
138  Outline method Routing,V-CUT,Stamp-hole
139  Min router bit diameter of outline mm 0.6 
140  Min. distance from hole to trace
(Not blind/buried holes)		 mil 6(≤8layers), 8(≤14layers), 9(≤28layers)
141  Min.distance from hole to trace
(blind/buried holes)		 mil 9(Press one time);10(press two times or three times)
142  Min distance from hole to trace
(Laser drill, 1 or 2-step)		 mil 6 
143  Min single-sided width for via hole pad of
outer layer		 mil 4( 12, 18um)3.5, 4.5(35um), 6(70um), 8(105um), 10(140um)
144  Min.distance without copper exposure
when outline routing		 mil 8 
145  Maximum insulation resistance(for test) MΩ 100 
146  Hole resistance test board thickness limit mm 0.38-5.0
147  Hole resistance test aperture limit mm min:0.62mm, max0.25mm
148  ionic soil ug/cm2 ≤1
149  Copper stripping strength N/cm 7.8 
150  Resistance weld hardness H 6 
151  Resistance 94V-0
152  RCC material um copper foil:12,resin:65, 100um(complete55, 90um)
153  Thkickness of blue glue mm 0.2-0.5
154  Min carbon pattern width mm 0.5mm
155  Copper thickness OZ Inner Layer 1OZ（35μm)-3OZ（105μm）\  Top Layer 1OZ（35μm)-12OZ（420μm）

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