✅ 1. Cost Revolution and Delivery Speed
Price Breakthrough:
💰 0.08/cm²** (for orders ≥100m²), representing a 60% cost reduction compared to European and American solutions
📉 Domestic LCP substrate ($10/m²) + 25% tariff exemption → 40% reduction in material costs
Ultra-Fast Delivery:
⏱️ 48-hour global delivery (3h for material allocation + 18h for production + 6h for full inspection), compared to an average of 7 days for European and American competitors
⚙️ 2. Core Performance Benchmarking
| Parameter | Traditional Solutions | Our Solution | Improvement |
|---|---|---|---|
| Minimum Line Width/Spacing | 75/75μm | 40/40μm | 47%↑ |
| Bending Life | 50,000 cycles | 200,000 cycles | 300%↑ |
| Impedance Control | ±10% | ±5% | 50%↑ |
| Thermal Stability | ΔZ ±15% | ΔZ ±3% | 80%↑ |
Process Innovation:
🔧 Composite laser drilling: 30% cost reduction, with a hole diameter ≤100μm (aspect ratio 1:1.5)
🛡️ Nano-silicone filling in the rigid-flex transition zone, with bending stress resistance >150MPa (verified through real-world testing with Huawei's TWS earbuds)
🌐 3. Cost-Effective Application Scenarios
Consumer Electronics (accounting for 65% of orders):
🎧 TWS earbud charging case: 6-layer rigid-flex PCB with a thickness of 0.25mm and a bending radius reliability of 99.5%
Green Manufacturing:
♻️ RoHS 3.0 + cyanide-free immersion gold process (gold thickness 0.05-0.1μm)
🌿 Wastewater reuse rate >95% (compared to the 80% requirement under China's national standard GB 8978-2025)
💡 5. Free Value-Added Services
Design Empowerment:
🛠️ Huawei DFM rule library: Open access to 127 rigid-flex zone design specifications (avoiding 89% of cracking risks)
📊 Online cost calculator: Real-time quote generation (including material, layer count, and process options)
Industrial Cluster Advantages:
🏭 Greater Bay Area supply chain: 98% material procurement radius (with copper foil/PP sheet recycling)
⚡ Process Innovation:
Plasma etching replacing chemical etching → 70% reduction in chemical solution costs
We lead in PCB manufacturing with advanced processes like high-precision drilling, fine-line fabrication (min. 50μm line width/spacing), and multi-layer lamination, meeting high-end routing density needs for stable signal transmission. A strict quality system ensures over 99.5% yield via flying probe and AOI tests. Our expert R&D team offers tailored solutions, from material selection to complex circuit design.
We provide FR-4, high-frequency, metal-core, and flexible boards, each with unique properties for various applications. Mass-produce 2 - 30 layer PCBs for efficient signal and power management. Customize board size, hole diameter, surface finish, and functions to fit specific scenarios.
Optimized production and advanced management shorten cycles. We control delivery for double-sided PCBs within [X] days and arrange multi-layer PCBs flexibly. With large capacity and emergency response, we avoid delays. Real-time tracking keeps clients informed.
Cost-saving measures enable competitive pricing without compromising quality. Transparent quotes detail all costs. Our PCBs excel in price, quality, and delivery, enhancing clients' product competitiveness.
Our sales team offers pre-sales expertise. Technical support spans design to production. We handle after-sales issues promptly
and conduct follow-ups for continuous improvement.
